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Title:
FORMATION OF THIN SUPERCONDUCTING FILM PATTERN
Document Type and Number:
Japanese Patent JPH03235380
Kind Code:
A
Abstract:
PURPOSE:To enhance the processing precision while avoiding the deterioration in the superconductivity characteristics after processing with enhanced precision by a method wherein a superconductor is ion-etched away using a metallic element as a mask and after etching process, an electrode material is heat- treated within a specific temperature range. CONSTITUTION:A photoresist layer 3, an element in low sputtering ratio to ions such as Al thin film 4, a photoresist layer 5 are coated on a high temperature superconductive thin film 2 formed on a single crystal substrate 1 and then the layer 5 is exposed to form a specific pattern and later the thin film 4 is etched away to be developed. Next, the layer 5 is ion-etched away to form the thin film 4, the layer 3 and the thin film 2 after the pattern. After finishing the etching process, the thin film 4, the layer 3 are lifted off to form a resist layer 7 and then exposed and developed to form a noble metal e.g. Au made electrode 8 further heat-treated in oxygen atmosphere within a range of 200-600 deg.C. Through these procedures, the thin film 2 can be processed with high precision taking complicated and fine shape further avoiding the deterioration in the superconductivity even after processing the thin film 2.

Inventors:
HASHIGUCHI SHOICHI
Application Number:
JP2963490A
Publication Date:
October 21, 1991
Filing Date:
February 13, 1990
Export Citation:
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Assignee:
SUMITOMO CEMENT CO
JAPAN RES DEV CORP
International Classes:
H01L39/24; (IPC1-7): H01L39/24
Domestic Patent References:
JPH01283887A1989-11-15
JPH0217684A1990-01-22
JPS6043827A1985-03-08
JPS62195125A1987-08-27
JPH01161788A1989-06-26
Attorney, Agent or Firm:
Kuramochi Yu



 
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