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Title:
FORMATION OF TRANSPARENT CONDUCTIVE FILM
Document Type and Number:
Japanese Patent JPH05282934
Kind Code:
A
Abstract:

PURPOSE: To avoid difference in thickness by applying ultrasonic vibration to a nozzle to spray and whereby reducing the diameter of an atomized metal compound and homogenizing it for effective adhesion to the surface of a substrate to be adhered.

CONSTITUTION: Ultrasonic energy is applied to a liquid metal compound 2 fed from an inlet port 8 to an atomized surface 9 by a piezoelectric device 10 to promote atomization. Effective atomization is achieved by designing the ultrasonic vibration so that the amplitude of the vibration reaches a maximum level at the atomized surface 9, and further grain refining and homogenization are achieved. A transparent conductive film in which difference in the thickness is drastically reduced, is thus formed. Since the grain refining with high atomization efficiency is achieved, the mass is reduced in relation to the momentum of the grain, and recoiling on the surface of a substrate to be adhered is small. Difference in the thickness is reduced thereby.


Inventors:
Hiroyuki Okushiba
Minoru Tsukada
Hiroshi Tajiri
Application Number:
JP7723692A
Publication Date:
October 29, 1993
Filing Date:
March 31, 1992
Export Citation:
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Assignee:
Kyocera Corporation
International Classes:
C23C18/12; G02F1/1343; H01B13/00; H01L31/04; (IPC1-7): H01B13/00; C23C18/12; G02F1/1343; H01L31/04



 
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