Title:
FORMED HEAT INSULATING MATERIAL
Document Type and Number:
Japanese Patent JPH01318033
Kind Code:
A
Abstract:
PURPOSE: To improve the adhesiveness and strength of the title material by compounding a liq. benzyl ether type phenol resin compsn. with a specified polyether, a catalyst, a foam stabilizer, a foaming agent and an org. polyisocyanate.
CONSTITUTION: A liq. benzyl ether type phenol resin compsn. (e.g., a phenol polyol) is compounded with 20-40% polyether (b) based on the composition, prepd. by using a non-amine active hydrogen compd. as an initiator (e.g., a polyether prepd. by using trimethlolpropane as an initiator), a catalyst, a foaming stabilizer, a foaming agent comprising dibromodifluoromethane and an org. polyisocyanate and foamed.
Inventors:
UEKADO KAZUTO
KATAOKA JINKO
NAKAMOTO HIDEO
KATAOKA JINKO
NAKAMOTO HIDEO
Application Number:
JP15076488A
Publication Date:
December 22, 1989
Filing Date:
June 17, 1988
Export Citation:
Assignee:
MATSUSHITA REFRIGERATION
International Classes:
C08J9/14; C08G18/00; C08G18/48; C08L75/04; (IPC1-7): C08G18/00; C08G18/48; C08J9/14; C08L75/04
Attorney, Agent or Firm:
Toshio Nakao (1 outside)
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