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Title:
FORMING APPARATUS FOR COATING FILM
Document Type and Number:
Japanese Patent JP3920514
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a coating film forming apparatus for forming a coating film with in-plane uniformity and satisfactory throughput and reducing vibrations generated by the apparatus.
SOLUTION: A wafer is held by a substrate-holding part which is movable in the Y-direction, and a coating solution nozzle movable in the X- and Y- directions is provided above the wafer. The coating solution nozzle is moved in the X-direction, while the coating solution is fed thereto, and the coating solution nozzle and the substrate-holding part are moved in the opposite direction, when the coating solution nozzle turns at the edge of the moving region in the X-direction. The movement is repeated, and the coating solution is fed over the entire wafer continuously. In addition to this way, each coating solution nozzle is provided on both side of the substrate, the nozzles are moved with point symmetry from the center of the substrate in the X-direction and the reverse direction to feed the coating solution. At this time the shock caused by the movement of each of the coating solution nozzle is transmitted through the substrate and canceled with each other and vibration is reduced.


Inventors:
Takahiro Kitano
Yuuki Morikawa
Yukihiko Ezaki
Nobukazu Ishizaka
Norihisa Koga
Kazuhiro Takeshita
Hirofumi Okuma
Akimoto Masami
Application Number:
JP36180699A
Publication Date:
May 30, 2007
Filing Date:
December 20, 1999
Export Citation:
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Assignee:
東京エレクトロン株式会社
International Classes:
B05C5/00; H01L21/027; B05C11/10; G03F7/16; (IPC1-7): H01L21/027; B05C5/00; B05C11/10; G03F7/16
Domestic Patent References:
JP10284397A
JP9029155A
JP11339642A
JP11326926A
JP11274264A
JP7171479A
JP11224854A
JP5267148A
JP5029442A
JP10074685A
Attorney, Agent or Firm:
Toshio Inoue
Mizuno Hiromi