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Title:
FORMING DIE OF ELECTROFORMING COMPONENT AND METHOD FOR MANUFACTURING ELECTROFORMING COMPONENT
Document Type and Number:
Japanese Patent JP2013224483
Kind Code:
A
Abstract:

To manufacture a solid electroforming component easily at low cost.

A forming die 10 of an electroforming component W is provided including a metal electrode plate 1 that has on one surface 1a thereof an electrode plane region 5 where the electroforming component W is formed by electroforming processing; and a resin-made coating 3 that has around the electrode plane region 5 a through hole 7 constituting an inner wall 7a rising from the electrode plane region 5, and makes the electrode plane region 5 of the metal electrode plate 1 be exposed to coat the one surface 1a. The electrode plate 1 and the coating 3 are integrally molded.


Inventors:
MATSUMURA HIROAKI
NIWA TAKASHI
MASUI YASUYUKI
Application Number:
JP2013032055A
Publication Date:
October 31, 2013
Filing Date:
February 21, 2013
Export Citation:
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Assignee:
SEIKO INSTR INC
International Classes:
C25D1/10; C25D1/00; C25D1/20
Domestic Patent References:
JP2006161138A2006-06-22
Attorney, Agent or Firm:
Kunio Ueda
Noriharu Fujita