Title:
FORMING DIE
Document Type and Number:
Japanese Patent JP2611089
Kind Code:
B2
Abstract:
PURPOSE: To eliminate need of changing dies, even when the thickness and height of a work are varied, by providing in a die body a supporting member by which a die chip is supported, a push-up force is transmitted and which is freely movable vertically.
CONSTITUTION: A recessed forming part 51 that is opened downward is provided in the punch body 49 of a punch 11. The horizontally movable die chip 81, which is freely vertically movable in a position opposite to the forming part 51 and engaged with the inclined face 85 of the die body 55, is provided in the die body 55. Simultaneously, the freely vertically movable supporting member 69 is provided, by which the die chip 81 is supported and the push-up force from below is transmitted. Thus, even when the thickness of the work to be processed is varied, a forming process is performed by merely varying the horizontal moving amount of the die chip, regardless of the thickness of the work and of the height for forming.
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Inventors:
Hiroshi Saito
Application Number:
JP17216392A
Publication Date:
May 21, 1997
Filing Date:
June 30, 1992
Export Citation:
Assignee:
Amada Metrex Co., Ltd.
International Classes:
B21D28/14; B21D5/01; B21D37/08; (IPC1-7): B21D5/01; B21D37/08
Domestic Patent References:
| JP50153590U | ||||
| JP58166920U |
Attorney, Agent or Firm:
Hidekazu Miyoshi (1 outside)