PURPOSE: An epoxy resin composition that is prepared by adding an internal mold releasing agent and a powder of fluorine resin to an epoxy resin composition, thus having good printing and releasing properties.
CONSTITUTION: To an epoxy resin composition containing an internal mold releasing agent is incorporated a fluorine resin. The fluorine resin is preferably the powder of polytetrafluoroethylene or may be powders of fluorinated ethylene-propylene copolymer or vinylidene fluoride polymer. The particle sizes of these powders are preferably less than 150μm, especially less 30μm. The internal mold releasing agent used is, e.g., an ester wax as carnauba or montan wax, or stearic acid, or zinc stearate. Especially when an ester wax is employed, high adhesion to bases as semiconductors is obtained.
SUZUKI HIDETO
KATOU FUMIHIKO
AIZAWA MIKIO
