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Patent Searching and Data


Title:
FORMING METHOD OF HEAT CONDUCTIVE SURFACE
Document Type and Number:
Japanese Patent JPS5840232
Kind Code:
A
Abstract:

PURPOSE: To easily prepare a heat conductive surface of high performance, by cutting the heat conductive surface in a glow-up state, forming many parallel fins, crushing the fins at an equal interval while applying vibration, and then rubbing the surface with a wire brush.

CONSTITUTION: A surface of a pipe and the like is cut by a cutting tool in a plow-up state to form many parallel fins 4. These fins are crushed at an equal interval while intermittently applying vibration, and the neighboring fins are intermittently jointed. A groove 5 between the fins 4 is formed to a fine tunnel 21, and through holes 22 of not jointed parts are caused to exist at an equal interval in a ceiling of the tunnel. Further the surface is worked by a wire brush to form many small protrusions and hollows, and a heat conductive surface of high heat conduction characteristic can be obtained.


Inventors:
SASAKI SATOSHI
YOSHIDA HIROMICHI
KAKIZAKI KIMIO
FUKUDA SHIGEO
Application Number:
JP13495481A
Publication Date:
March 09, 1983
Filing Date:
August 28, 1981
Export Citation:
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Assignee:
HITACHI CABLE
International Classes:
B23P15/26; B21D31/00; (IPC1-7): B23P15/26