Title:
FORMING METHOD OF PIN-SHAPE WIRE OR THE LIKE
Document Type and Number:
Japanese Patent JP3566156
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To obtain a uniform length of pin-shape wires stably and to predetermine a wire length above a ball arbitrarily which is bonded to an electronic circuit element or the like, without raising a cost.
SOLUTION: A ball 1a is formed at the front end of a wire 1 which is inserted through a capillary 4, after which the wire is extended from the bottom end of the capillary 4. A part of the wire 1 between the ball 1a and the wire is cut to make a flaw 1b with a cutter 6 and the ball 1a is bonded to an electrode pad 8 by using the capillary 4. After raising the capillary 4, the wire 1 is pulled upward so as to cut the wire 1 off at the flaw 1b into a pin-shape wire or the like 9.
Inventors:
Kazuo Sugiura
Hirofumi Moroe
Fumihiko Kato
Yasuyuki Komachi
Hirofumi Moroe
Fumihiko Kato
Yasuyuki Komachi
Application Number:
JP34299699A
Publication Date:
September 15, 2004
Filing Date:
December 02, 1999
Export Citation:
Assignee:
Shinkawa Co., Ltd.
International Classes:
H01L21/48; H01L21/60; H01L21/607; (IPC1-7): H01L21/60
Domestic Patent References:
| JP2001118876A | ||||
| JP3513444B2 | ||||
| JP63296248A | ||||
| JP1064911A | ||||
| JP10144689A | ||||
| JP11297736A |
Attorney, Agent or Firm:
Yoshinori Tanabe