Title:
FORMING METHOD FOR SUPERCONDUCTING WIRING PATTERN
Document Type and Number:
Japanese Patent JPS63310197
Kind Code:
A
Abstract:
PURPOSE: To easily form a fine wiring pattern while maintaining preferable conductivity by polishing sintered superconducting oxide formed in a bulk state, forming it in a thin plate state, and then patterning it.
CONSTITUTION: A superconductor 2 is bonded by an adhesive 3 to an insulating support 1. The superconductor 2 contains at least one or more elements selected from group IIa elements, and at least one or more elements selected from group IIIa elements, and is made of sintered oxide containing copper. Then, the oxide 2 is polished in a thin plate state to remove it except a desired wiring section. Thus, a desired wiring pattern is formed on an insulating substrate while maintaining preferable superconductor characteristic.
Inventors:
SAITO MASAYUKI
OUCHI MASAYUKI
NAKAI TOSHIO
SUDO TOSHIO
OUCHI MASAYUKI
NAKAI TOSHIO
SUDO TOSHIO
Application Number:
JP14516987A
Publication Date:
December 19, 1988
Filing Date:
June 12, 1987
Export Citation:
Assignee:
TOSHIBA CORP
International Classes:
H01L39/06; H05K3/02; H05K3/06; (IPC1-7): H01L39/06; H05K3/06
Attorney, Agent or Firm:
Noriyuki Noriyuki