PURPOSE: To prevent a decrease in performance as Cu wirings and to easily efficiently form wirings with high reliability by forming a Cu film on a surface of an insulating film, oxidizing from a surface of the Cu film to a surface having no recess of the insulating film, and removing the oxidized Cu film.

CONSTITUTION: An insulating film 13 is formed on one surface of a substrate 12. Then, a trench 14 of a recess is formed on a surface of the film 13. Thereafter, a Cu film 16 is formed on the surface of the film 13. Subsequently, the film 16 is oxidized from a surface of the film 16 to a thickness up to a surface, where no trench 14 is formed, of the film 13, i.e., a thickness d3. Last, a copper oxide film 17 is removed. Thus, corrosion occurs from residual reactive product, and a decrease in performance as wirings is eliminated. Heating or cooling of the stage is eliminated, and the manufacturing efficiency can be improved. Accordingly, Cu wirings 11 having a high reliability can be easily and efficiently formed.