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Title:
FOUR LAYER PRINTED-WIRING BOARD
Document Type and Number:
Japanese Patent JP3287746
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To make feasible of high quality mounting having thin and smoothed surface in less dispersion in thickness by successively laminating a specific optic-thermosetting undercoat layer, a specific interlayer insulating adhesive layer and copper foil on both surfaces of internal layer circuit board made of flame retardant epoxy resin impregnated glass cloth substrate.
SOLUTION: An undercoating agent for an undercoating layer 3 is made from the following components for filling up the copper foil circuit gap of an internal layer circuit board 1 for smoothing the surface of an internal layer circuit 2. That is, novolak type epoxy resin in brominating percentage exceeding 20% and molecular weight of 500-4000, bisphenol type epoxy resin in molecular weight of 500-2000, bisphenol type epoxy resin in molecular weight not exceeding 500, glycylglycine acrylate, etc., hydroxy ehtyl acrylate, etc.; optical polymerization initiator; imidazole compound in melting point exceeding 130°C and low temperature setting type imidazole compound. As for the interlayer insulating adhesive layer 4, epoxy resin, etc., in the mean molecular weight exceeding 10000 is applicable.


Inventors:
August first day Takeshi
Toyoaki Kishi
Tomomi Honjoya
Application Number:
JP29117095A
Publication Date:
June 04, 2002
Filing Date:
November 09, 1995
Export Citation:
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Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08G59/40; C08G59/00; C09D163/00; C09J163/00; H05K1/03; H05K3/38; H05K3/46; (IPC1-7): H05K3/46; C08G59/40; C09D163/00; H05K1/03; H05K3/38
Domestic Patent References:
JP7202433A
JP7245480A
JP7245485A