Title:
FPC FOR FINE WIRING
Document Type and Number:
Japanese Patent JPS6490587
Kind Code:
A
Abstract:
PURPOSE: To prevent thermal shrinkage by forming a metal foil on the rear face of an FPC on which a fine wiring pattern has been formed.
CONSTITUTION: A desired fine pattern 2 is formed on one side face of a base substrate 1 made of polyimide or the like, and several metal foils 3 are formed on the whole rear face of the pattern 2 perpendicularly to the pattern 2. Thus, its thermal shrinkage can be suppressed to 1/4 or below that of a conventional FPC.
Inventors:
SONEHARA HIDEAKI
Application Number:
JP24882487A
Publication Date:
April 07, 1989
Filing Date:
October 01, 1987
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
H05K1/14; H05K1/00; H05K1/02; (IPC1-7): H05K1/14
Attorney, Agent or Firm:
Mogami (1 person outside)