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Patent Searching and Data


Title:
FRAME FOR PACKAGE SUBSTRATE AND METHOD FOR GRINDING PACKAGE SUBSTRATE
Document Type and Number:
Japanese Patent JP2019147203
Kind Code:
A
Abstract:
To provide a frame for a package substrate capable of reducing the cost of grinding processing by performing grinding processing of a package substrate without executing a large scale of alteration of a grinding device.SOLUTION: A frame for a package substrate 2 to be used during grinding a mold resin by holding a package substrate in which a region is covered with the mold resin except an end material region of the surface of the substrate including the end material regions at a peripheral part by suction by a chuck table includes: a disk-shaped frame body 4 having a diameter equal to or larger than the diameter of the suction surface of the chuck table provided with a circular suction surface for sucking a workpiece; opening parts 4d for exposing the mold resin of the package substrate formed on the frame body; and eaves parts 6 provided along the outer periphery of the opening parts to cover the end material regions.SELECTED DRAWING: Figure 1

Inventors:
UMEDA YOSHIO
MIYAMOTO HIROKI
Application Number:
JP2018032027A
Publication Date:
September 05, 2019
Filing Date:
February 26, 2018
Export Citation:
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Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B41/06; B24B7/04
Domestic Patent References:
JP2016159412A2016-09-05
JP2009061568A2009-03-26
JPH06302569A1994-10-28
JP2015082627A2015-04-27
JP2017127945A2017-07-27
Foreign References:
US20020093086A12002-07-18
Attorney, Agent or Firm:
Akira Matsumoto
Tomohiro Okamoto
Kasahara Takahiro