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Title:
FRAME STRUCTURE OF TRANSLUCENT SOUND INSULATION PANEL
Document Type and Number:
Japanese Patent JP2018123626
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a frame structure of a translucent sound insulation panel which does not melt even if it is subjected to heat for a predetermined period of time, and are not broken to be scattered even by a predetermined impact, so as to be able to exercise various performances required for a translucent sound insulation panel, and also capable of using in combination with any type of translucent sound insulating plate of either a resin plate or a glass plate.SOLUTION: In a translucent sound insulation panel provided with a panel frame to which a translucent sound insulation plate G1 is fitted, a sound insulation plate mounting groove (recess 53) having a predetermined width is provided which can seal both the plate surfaces by fitting a translucent sound insulation plate having a glass plate to the panel frame; a batten which presses and fixes one surface of the translucent sound insulation plate having a resin plate in the sound insulation plate mounting groove can be fitted by pressed into outside of the surface internal direction of the translucent sound insulation plate having the resin plate; and therefore, either the translucent sound insulation plate having a glass plate or the translucent sound insulation plate having a resin plate can be fitted.SELECTED DRAWING: Figure 9

Inventors:
山本 健次郎
Application Number:
JP2017017908A
Publication Date:
August 09, 2018
Filing Date:
February 02, 2017
Export Citation:
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Assignee:
日鐵住金建材株式会社
International Classes:
E01F8/00
Attorney, Agent or Firm:
安彦 元