Title:
TAPE CARRIER PACKAGE AND PAD FOR MOUNTING
Document Type and Number:
Japanese Patent JPH0697224
Kind Code:
A
Abstract:
PURPOSE: To provide a tape carrier package having high mounting density.
CONSTITUTION: Four holes 15 are provided on an electrically insulative tape 10 making a square shape. An IC chip 11 is attached in such a manner that it is positioned in the center of the square shape constituted by the four holes 15. A plurality of leads 13 extended from the IC chip 11 are adhered to the surface of the tape 10. The tip of the lead 13 is positioned outside the holes 15. An IC chip 12 is attached in such a manner that it is located in the center of the square shape formed by the four holes 15. A plurality of leads 14, extended from the IC chip 12, are adhered to the back side of the tape 10. The tips of the leads 14 are positioned inside the holes 15.
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Inventors:
OISHI SHIGEO
Application Number:
JP26943992A
Publication Date:
April 08, 1994
Filing Date:
September 12, 1992
Export Citation:
Assignee:
PFU LTD
International Classes:
H01L21/60; H01L23/50; (IPC1-7): H01L21/60; H01L23/50
Domestic Patent References:
| JPH02106943A | 1990-04-19 | |||
| JPH03248543A | 1991-11-06 |
Attorney, Agent or Firm:
Kyotani Shiro (1 person outside)
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