Title:
フライドチャンク食品組成物
Document Type and Number:
Japanese Patent JP5624557
Kind Code:
B2
Abstract:
The invention provides fried-chunk food compositions comprising (1) food chunks that have been fried in oil at a temperature of from about 110 to 205° C. to produce fried food chunks having a moisture content of about 16% and an Aw of about 0.7 and (2) from about 5 to about 35% plasticizer applied to the fried food chunks, wherein the fried food chunks with applied plasticizer have a moisture content of about 12% or less and an Aw of about 0.65 or less. The compositions are made without using preservatives, have a desirable texture and appealing meat-like appearance, and are shelf-stable and therefore do not spoil due to unwanted microbial growth.
Inventors:
ディクソン，ダン， ケー．
Application Number:
JP2011544413A
Publication Date:
November 12, 2014
Filing Date:
December 30, 2009
Export Citation:
Assignee:
ネステク ソシエテ アノニム
International Classes:
A23K1/10; A23K3/00; A23L5/10; A23L13/10; A23L13/20; A23L13/60; A23L29/00
Attorney, Agent or Firm:
Yoshiki Hasegawa
Tomoya Kurokawa
Yoshinori Shimizu
Ikeda Adult
戸津 Yosuke
Tomoya Kurokawa
Yoshinori Shimizu
Ikeda Adult
戸津 Yosuke