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Patent Searching and Data


Title:
フライドチャンク食品組成物
Document Type and Number:
Japanese Patent JP2012514456
Kind Code:
A
Abstract:
The invention provides fried-chunk food compositions comprising (1) food chunks that have been fried in oil at a temperature of from about 110 to 205° C. to produce fried food chunks having a moisture content of about 16% and an Aw of about 0.7 and (2) from about 5 to about 35% plasticizer applied to the fried food chunks, wherein the fried food chunks with applied plasticizer have a moisture content of about 12% or less and an Aw of about 0.65 or less. The compositions are made without using preservatives, have a desirable texture and appealing meat-like appearance, and are shelf-stable and therefore do not spoil due to unwanted microbial growth.

Inventors:
Dixon, Dan, Kay.
Application Number:
JP2011544413A
Publication Date:
June 28, 2012
Filing Date:
December 30, 2009
Export Citation:
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Assignee:
Nestec Society Anonymous
International Classes:
A23K1/10; A23K3/00; A23L5/10; A23L13/10; A23L13/20; A23L13/60; A23L29/00
Domestic Patent References:
JP2003527125A2003-09-16
JP2003513679A2003-04-15
JP2005502372A2005-01-27
JP2002501730A2002-01-22
JP2007512849A2007-05-24
JP2003527125A2003-09-16
JP2003513679A2003-04-15
JP2005502372A2005-01-27
Foreign References:
US4039692A1977-08-02
US20040197455A12004-10-07
WO2008085293A22008-07-17
US4039692A1977-08-02
US20040197455A12004-10-07
WO2008085293A22008-07-17
Attorney, Agent or Firm:
Yoshiki Hasegawa
Tomoya Kurokawa
Yoshinori Shimizu
Ikeda adult
Tosuke Yosuke