Title:
PUNCH DIE DEVICE FOR SEMICONDUCTOR ELEMENT BONDING TAPE
Document Type and Number:
Japanese Patent JP3180296
Kind Code:
B2
Abstract:
PURPOSE: To punch an adhesive tape after correcting curl of an adhesive type in a path by forming the path for the adhesive tape provided on a guide die in such a manner that the height of the path is gradually decreased from the inlet toward the central area.
CONSTITUTION: As a measure for correcting curl of an adhesive tape 3, the height of an adhesive tape path 12 formed on a guide die 11 is gradually decreased from the inlet side toward the central area, and the height in an area for punching is substantially equal to the thickness of the adhesive tape 3. Thus, at least in the punching position, curl of an adhesive tape piece is corrected so that punching can be performed, with the suction hole of a punch 1 substantially completely covered up.
Inventors:
Ishizuka
Application Number:
JP9593492A
Publication Date:
June 25, 2001
Filing Date:
March 23, 1992
Export Citation:
Assignee:
Sumitomo Metal Mining Co., Ltd.
International Classes:
B21D28/00; B26F1/00; H01L21/52; H01L21/60; (IPC1-7): B26F1/00; H01L21/52
Domestic Patent References:
| JP375999U | ||||
| JP6246132U |
Attorney, Agent or Firm:
Yoshiteru Oshida