Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
燃料電池車両
Document Type and Number:
Japanese Patent JP4192535
Kind Code:
B2
Abstract:

To prevent structural units composing a fuel cell system and having inferior heat resistance from being exposed to structural units generating heat, without providing additional components such as a heat shielding plate and the like.

When arranging structural units composing the fuel cell system including a secondary battery 12, such as a fuel cell 8, a reforming device 9, an air system auxiliary machine 10, a fuel tank 11, the secondary battery 12, and a driving module 13 under the floor of a vehicle, they are divided to a structural unit group 21 composed of the fuel cell 8, the reforming device 9, and the air system auxiliary machine 10 which generate high temperatures, and a structural unit group 22 composed of the secondary battery 12 and the driving module 13 which have inferior heat resistance, and the unit group 21 generating high temperatures and the unit group 22 having inferior heat resistance are mounted under the floor of the vehicle by separating them right and left in the horizontal direction (vehicle width direction) of the vehicle. At this point, they are separately arranged so that the unit group 21 generating high temperatures is positioned at the right side where a driving motor 6 generating a large amount of heat is positioned in the horizontal direction of the vehicle.

COPYRIGHT: (C)2004,JPO


Inventors:
Yokote Masatsugu
Application Number:
JP2002255061A
Publication Date:
December 10, 2008
Filing Date:
August 30, 2002
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Nissan Motor Co., Ltd
International Classes:
B60K1/00; H01M8/04; B60K1/04; B60L11/18; H01M8/00; H01M8/10
Domestic Patent References:
JP5062697A
JP5169981A
JP5290868A
JP10172584A
JP9171842A
JP10110812A
JP2001071753A
JP2001113960A
JP2002104000A
Attorney, Agent or Firm:
Kenji Sugimura
Shiro Fujitani
Kosaku Sugimura



 
Previous Patent: 回転軸装置

Next Patent: INNER LEAD BOND FOR IC CHIP