Title:
BINDING METHOD, AND ITS APPARATUS
Document Type and Number:
Japanese Patent JP3151557
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To smoothly achieve the end treatment of a binding tape wound around an object to be bound by a binding apparatus.
SOLUTION: A tape end adhesion roll 36 and a tape end holding member 39 are provided on a drop route when a bound object 6 is dropped from a loading table 18. The object 6 is dropped between the tape end adhesion roll 36 and the tape end holding member 39. The tape end adhesion roll 36 is turned in the direction (c) of the arrow. As the tape end adhesion roll 36 is turned, the object 6 is lowered through a clearance between the tape end adhesion roll 36 and the tape end holding member 39 while turned. In this process, an end part of a binding tape wound around the object 6 is brought into slidable contact with the tape end adhesion roll 36 or the tape end holding member 39, and adhered to the object 6 so as to be pushed down.
Inventors:
Toshimasa Kakita
Application Number:
JP34261998A
Publication Date:
April 03, 2001
Filing Date:
December 02, 1998
Export Citation:
Assignee:
Nichiban Co., Ltd.
International Classes:
B65B13/04; B65B13/18; (IPC1-7): B65B13/04
Domestic Patent References:
| JP63307017A | ||||
| JP57123705U | ||||
| JP58156604U | ||||
| JP6248904U |
Attorney, Agent or Firm:
Nobuo Kaida (3 outside)
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