FUNCTIONAL ELEMENT MOUNTED MODULE AND MANUFACTURING METHOD THEREOF

Japanese Patent JP3936365

B2

PROBLEM TO BE SOLVED: To provide an optical functional element module that dispenses with a high-priced and special member and may be miniaturized, and to provide a manufacturing method of the same.
SOLUTION: A bank 7 that damps up a liquid sealing resin 8 is provided around an optical functional element 3 on a substrate 2 on which the optical functional element 3 is mounted where a predetermined wiring pattern is formed, the liquid sealing resin 8 is dropped between the optical functional element 3 and the bank 7 to fill the sealing resin 8 therebetween, a package component member 9 having an optical permeation hole 9a corresponding to the optical functional section of the optical functional element 3 is contacted with the sealing resin 8 by contacting the package component member 9 with the bank 7 with the optical permeation hole 9a opposed to the optical functional section 30 of the optical functional element 3. Further, the sealing resin 8 is cured to bond the package component member onto the substrate 2, and the bank 7 is finally cut off and removed.

Yoshihiro Yoneda
Takahiro Asada

JP2005019116A

June 27, 2007

January 27, 2005

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Sony Chemical & Information Device Co., Ltd.

H01S5/022; H01L21/56; H01L31/02

JP2003068939A
JP2002094082A
JP2002016267A
JP6061523A
JP61032535A
JP11261095A
JP55128880A
JP2002076376A
JP2002222935A
JP11121653A

Hideki Abe
Shigeo Ishijima

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