Title:
半導体機能素子付き機能糸とその製造方法
Document Type and Number:
Japanese Patent JP5716197
Kind Code:
B2
Abstract:
Disclosed is a method for manufacturing a functional thread (1) that is provided with semiconductor functional elements, said functional thread being provided with a plurality of granular semiconductor functional elements (2), and a pair of flexible conductive lines (5, 6) that connect the semiconductor functional elements (2) parallel to each other. The method is provided with: a first step wherein the pair of conductive lines (5, 6) are supplied to an assembly stage (44) from a conductive line supply source (43), and on the assembly stage (44), the pair of conductive lines (5, 6) are disposed in a parallel state such that the semiconductor functional elements (2) can be sandwiched via positive and negative electrodes; a second step wherein the semiconductor functional elements (2) are arranged in a state wherein the conductive directions thereof are aligned with each other, and the semiconductor functional elements are supplied to the assembly stage (44) from a semiconductor functional element supply source (41); a third step wherein, on the assembly stage (44), a paste-like conductive bonding material (8) is applied to portions where the pair of conductive lines (5, 6) and positive and negative electrodes are respectively in contact with each other; and a fourth step wherein, in the downstream of the assembly stage (44), the pair of conductive lines (5, 6), which have the semiconductor functional elements (2) attached thereto, are taken up by means of a take-up means (48).
Inventors:
Yusuke Nakata
Soichiro Imoto
Ikuo Inagawa
Nakamura Hidetoshi
Atsushi Masuda
Tetsuhiko Murakami
Soichiro Imoto
Ikuo Inagawa
Nakamura Hidetoshi
Atsushi Masuda
Tetsuhiko Murakami
Application Number:
JP2013539482A
Publication Date:
May 13, 2015
Filing Date:
October 21, 2011
Export Citation:
Assignee:
Sphelar Power Corporation
Fukui prefecture
Fukui prefecture
International Classes:
D02G3/44; D02G3/04; D02G3/36; H01L21/329; H01L29/861; H01L29/868; H01L31/0352; H01L31/068; H01L33/00
Domestic Patent References:
| JP2006313871A | ||||
| JP2007314925A | ||||
| JP2011074512A | ||||
| JP2011018683A |
Foreign References:
| WO2004001858A1 | ||||
| WO2010016099A1 |
Attorney, Agent or Firm:
Toshio Okamura