To provide a substrate-type fuse with resistor comprising a film resistor and a fuse element provided on an insulating substrate, wherein the heat capacity of the insulating substrate is reduced by reducing the plane dimensions of the substrate and the blowout of the fuse element is expedited by enhancing the speed of energization and heat generation of the resistor.

A film resistor 11, a membrane electrode 13 for fuse element bonding and a membrane electrode 12 for lead conductor connection are provided on one surface of an insulating substrate chip 1, the electrodes 12 and 13 being separated at a predetermined membrane resistance distance from each other. A lead conductor 22 is connected to the membrane electrode 12, and a middle portion of a fuse element 3 is bonded to the membrane electrode 13. Lead conductors 23a, 23b separate from the lead conductor 22 are bonded to both ends of the fuse element 3, respectively.