Title:
溶融樹脂切断処理システム
Document Type and Number:
Japanese Patent JP5403188
Kind Code:
B2
Abstract:
Provided is a molten resin cutting system for efficiently cutting a molten resin extruded through an extrusion orifice of an extruder. The molten resin cutting system is characterized in that: a molten resin (13) extruded from an extruder (10) is guided to a cutter (40) on a chute (2) while the guided resin is cooled, the cutter (40) comprising a cutter roller (41) and an assist roller (42); the molten resin (13) transported from the chute (20) to the cutter (40) is pulled and cut in the cutter (40) by the cutter roller (41); the molten resin (13) is then formed into resin chips (c) by the cutter (40); and the resin chips (c) are cooled and transported by a cooling and transporting means (50) located directly below and downstream from the vicinity of the cutter (40).
Inventors:
Shoichiro Takano
Yuji Iwakiri
Taketoshi Mano
Yuji Iwakiri
Taketoshi Mano
Application Number:
JP2013515052A
Publication Date:
January 29, 2014
Filing Date:
April 18, 2012
Export Citation:
Assignee:
Toyo Seikan Kaisha, Ltd.
International Classes:
B29B9/06; B29B11/06; B29B17/00; B29C31/00; B29C48/07; B29C48/08
Domestic Patent References:
| JP2007181949A | 2007-07-19 | |||
| JP2008068517A | 2008-03-27 | |||
| JP2004202815A | 2004-07-22 | |||
| JP2008296408A | 2008-12-11 |
Attorney, Agent or Firm:
Ono Pure in addition
Sachiko Okunuki
Sayaka Masuda
Sachiko Okunuki
Sayaka Masuda