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Patent Searching and Data


Title:
GAS BARRIER RESIN FILM
Document Type and Number:
Japanese Patent JPH1058587
Kind Code:
A
Abstract:

To provide a transparent resin film for packaging which has good gas barrier properties and enough strength both before and after boiling treatment or retort treatment and enables proper heat sealing and good moisture- proofing.

A gas barrier resin film has an inorganic deposition layer, an adhesive layer, and a polyolefin layer laminated in sequence on a backing, and the backing is a film made chiefly from polyamide. When the film of polyamide is boiled at 95°C for 30min, the maximum shrinkage stress per unit cross section in an optional direction is 0.900kgf/mm2 or more.


Inventors:
YONEDA SHIGERU
YOKOYAMA SEIICHIRO
IZEKI SEIJI
HARIMA TEIZO
UNO TOSHIO
YAMADA YOZO
Application Number:
JP21849196A
Publication Date:
March 03, 1998
Filing Date:
August 20, 1996
Export Citation:
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Assignee:
TOYO BOSEKI
International Classes:
B65D65/40; B29C55/02; B32B7/02; B32B9/00; B32B27/32; B32B27/34; C23C14/08; C23C14/10; C23C14/20; B29K23/00; B29K77/00; B29L9/00; (IPC1-7): B32B9/00; B32B7/02; B32B27/32; B32B27/34; B65D65/40; C23C14/08; C23C14/10; C23C14/20
Attorney, Agent or Firm:
Shusaku Yamamoto