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Title:
ガス分配装置及び基板処理チャンバ
Document Type and Number:
Japanese Patent JP4964223
Kind Code:
B2
Abstract:
Techniques of the present invention are directed to distribution of deposition gases onto a substrate. In one embodiment, a gas distributor for use in a processing chamber is provided. The gas distributor includes a body having a gas deflecting surface and a gas distributor face. The gas deflecting surface defines a cleaning gas pathway. The gas distributor face is disposed on an opposite side of the body from the gas deflecting surface and faces toward a substrate support member. The gas distributor face includes a raised step and at least one set of apertures through the raised step. The at least one set of apertures are adapted to distribute a deposition gas over a substrate positioned on the substrate support member.

Inventors:
Ray, Lawrence, Chun-Rye
Roux, saiking
Giannourakis, Stephen, E.
Bang, won, bee.
Sun, David, Pea.
Wang, Yen-Kun, Victor
Application Number:
JP2008500824A
Publication Date:
June 27, 2012
Filing Date:
March 06, 2006
Export Citation:
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Assignee:
APPLIED MATERIALS,INCORPORATED
International Classes:
H01L21/205; C23C16/455
Domestic Patent References:
JP2006245533A
JP2002158180A
Foreign References:
WO2003034463A1
Attorney, Agent or Firm:
Sonoda Yoshitaka
Kobayashi Yoshinori
Ikeda adult



 
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