Title:
ゲートブレイク方法及びゲートブレイク装置
Document Type and Number:
Japanese Patent JP7306130
Kind Code:
B2
Abstract:
To provide a gate break device that can more reliably prevent resin burrs from remaining on an end face 89 of a lead frame 80 when performing gate break to remove unnecessary resins such as cal 81 and runner 82 from a resin-sealed molded product 8.SOLUTION: A gate break device G includes a holding portion 12 having a mounting portion for a lead frame 80, a fixing plate 23 that holds the lead frame 80 in cooperation with the holding portion 12, a protrusion that elastically deforms the lead frame 80 in the direction away from the mounting portion as the fixing plate 23 comes into close contact with each other, a punch plate 24 that moves closer to the holding portion 12 and punches a runner 82 from a held resin-sealed molded product 8, an inner punch pin 28, and an outer punch pin 27, and the outer punch pin 27 is formed longer than the inner punch pin 28 so as to punch out at an earlier timing than the inner punch pin 28.SELECTED DRAWING: Figure 1
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Inventors:
Keiden Ikuta
Application Number:
JP2019134317A
Publication Date:
July 11, 2023
Filing Date:
July 22, 2019
Export Citation:
Assignee:
I-PEX Inc.
International Classes:
H01L21/56; B29C45/38
Domestic Patent References:
| JP7276418A | ||||
| JP10150135A | ||||
| JP2194539A | ||||
| JP9036156A | ||||
| JP5326584A |
Foreign References:
| KR1020040075479A |
Attorney, Agent or Firm:
Shuichiro Ariyoshi
Yasuyuki Morita
Nobuyoshi Tsutsui
Satoko Endo
Yasuyuki Morita
Nobuyoshi Tsutsui
Satoko Endo