Title:
GATE CUTTING DEVICE FOR PLASTIC MOLDED GOODS
Document Type and Number:
Japanese Patent JP3104138
Kind Code:
B2
Abstract:
PURPOSE: To use a cutting device for the gate parts of plastic molded goods as a conveyor device for the plastic molded goods so as to attain space saving.
CONSTITUTION: The gate part of an automobile bumper W transferred onto a supporting device 6 from an injection-molding device 3 by a take-out device 5 is cut/removed by a cutter 37 mounted to the tip of the robot arm 33 by a cutter 37 mounted to the tip of the robot arm 33 of a cutting device 7 formed of an articulated robot. The bumper W cut at its gate part is suction-held by a suction means 40 mounted to the tip of the robot arm 33 and discharged to a transfer device 10 from the supporting device 6. The bumper W is further sent to a stock place by a conveyor device 12. During the cutting work performed by the cutter 37, the suction means 40 is removed from the robot arm 33 and placed on a placing base 9 so as not to be a hindrance to the cutting work.
Inventors:
Haruki Kato
Mayumi Noriyuki
Mayumi Noriyuki
Application Number:
JP22300991A
Publication Date:
October 30, 2000
Filing Date:
September 03, 1991
Export Citation:
Assignee:
Honda motor industry stock company
International Classes:
B26D7/18; B26D3/00; B29C37/02; B29C45/38; (IPC1-7): B26D7/18; B26D3/00; B29C37/02
Domestic Patent References:
| JP59188181A | ||||
| JP6233133A | ||||
| JP60217100A | ||||
| JP366591A |
Attorney, Agent or Firm:
Ken Ochiai (1 person outside)
Previous Patent: JPH03104137
Next Patent: SEMICONDUCTOR DEVICE PROVIDED WITH MULTILAYER WIRING AND MANUFACTURE THEREOF
Next Patent: SEMICONDUCTOR DEVICE PROVIDED WITH MULTILAYER WIRING AND MANUFACTURE THEREOF