Title:
GELLING REDUCTION TOOL FOR GROOVING CHEMICAL MECHANICAL PLANARIZATION POLISHING PADS
Document Type and Number:
Japanese Patent JP2018171703
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a grooving tool for reducing the problem of gelling defects caused in machining CMP polishing pads to form grooves therein.SOLUTION: The present invention provides a grooving tool for machining a surface of a polymeric foam article, such as a chemical mechanical (CMP) polishing pad, the grooving tool comprising: a flat bed platen on which the article is placed; and a grooving tool frame having a front face facing in parallel the flat surface of the polymeric foam article on which front face is contained one or more cutting tool teeth arranged in a predetermined direction and with a constant pitch. Each cutting tool tooth has: a non-cutting shoulder part that joins the grooving tool frame; (i) a groove cutting face that forms a rake angle ranging from 2° to 80°; (ii) a chip ejection face located on a top of the tooth between the non-cutting shoulder part and the groove cutting face; and (iv) a shouldering radius transitioning from the cutting tool tooth to the non-cutting shoulder part.SELECTED DRAWING: None
Inventors:
PATRICK S DELANEY
JEFFREY ROBERT STACK
CANTRELL BRIAN T
JEFFREY ROBERT STACK
CANTRELL BRIAN T
Application Number:
JP2018045438A
Publication Date:
November 08, 2018
Filing Date:
March 13, 2018
Export Citation:
Assignee:
ROHM & HAAS ELECTRONIC MAT CMP HOLDINGS INC
International Classes:
B23B27/04; B23B5/14; B24B37/20; H01L21/304
Attorney, Agent or Firm:
Patent business corporation Tsukuni