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Title:
GENERAL PURPOSE GATE POSITION RESIN MOLDING APPARATUS
Document Type and Number:
Japanese Patent JP3246848
Kind Code:
B2
Abstract:

PURPOSE: To conduct molding while preventing the resin from sticking to the resin molding part of a mold by placing a film between a raw material and the resin passage of the mold and setting with the side margin of the film arranged to coincide with the marginal position of an adjacent cavity.
CONSTITUTION: A slit-shaped cavity suction hole 12 is formed in the marginal part of the inner bottom surface of a cavity recession part 11, and a suction hole 13 is opened on the clamp surface of a mold 10 (10a, 10b) around the cavity recession part 11. The cavity suction hole 12 and the suction hole 13 are connected to an air suction mechanism respectively, and when a release film 40 is set in the mold 10, first the film 40 is sucked to the clamp surface by the suction hole 13 to be supported, and next air is sucked by the suction hole 12 so that the film 40 is supported along the shape of the inner surface of the cavity recession part 11. In this way, a resin is molded without contacting directly the mold 10 to prevent the resin from sticking to the resin molding part of the mold.


Inventors:
Fumio Miyajima
Application Number:
JP3349395A
Publication Date:
January 15, 2002
Filing Date:
February 22, 1995
Export Citation:
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Assignee:
Apic Yamada Co., Ltd.
International Classes:
B29C33/68; B29C45/02; B29C45/14; B29C45/46; B29C45/26; H01L21/56; B29K105/20; B29L31/34; (IPC1-7): B29C45/14; B29C33/68; B29C45/02; B29C45/26; H01L21/56
Domestic Patent References:
JP2191111A
JP1202848A
JP2134835A
JP425054A
JP687139A
JP645384A
JP5144865A
JP3248817A
JP817855A
JP8156029A
JP8186141A
JP8203944A
Other References:
【文献】米国特許3754070(US,A)
Attorney, Agent or Firm:
Takao Watanuki (1 outside)