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Title:
レーザー光照射による硬実種子の発芽改善方法及び発芽改善種子
Document Type and Number:
Japanese Patent JP4343790
Kind Code:
B2
Abstract:
Providing a method for improving the germination of plant seeds for use in agriculture, gardening and tree planting on mountains and in forests, where the germination of the seeds is suppressed physically or physiologically due to the hard seed coat (testa or pericarp or the like) as the structures surrounding seed embryos, by secure and uniform treatment of each seed without any damage of seed embryo to produce seeds with improved germination in a stable manner without any loss and without creating problems in the working environment, and providing germination improved seeds. Germination is improved by allowing laser beam to irradiate a part of the seed coat of a plant seed to perforate a part of the seed coat to thereby overcome physical or physiological factors causing the suppression of germination, such as gas permeability and water permeability to seed embryo.

Inventors:
Yoshihisa Watanabe
Kyoji Wakisaka
Haruo Hitomi
Application Number:
JP2004214942A
Publication Date:
October 14, 2009
Filing Date:
July 22, 2004
Export Citation:
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Assignee:
Takii Seed Co., Ltd.
International Classes:
A01C1/00; A01C1/02; A01H3/00; A01H3/02; A01H4/00
Domestic Patent References:
JP11056014A
JP11313649A
JP2001352861A
JP7257956A
Attorney, Agent or Firm:
Tamako Tsutada
Masato Tsuda



 
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