Title:
ガラス体研磨方法及びガラス体研磨装置
Document Type and Number:
Japanese Patent JP6976282
Kind Code:
B2
Abstract:
To provide a glass body polishing method and a glass body polishing device which can achieve reduction in polishing cost.SOLUTION: A polished article W is polished by CMP method by interposing a polishing liquid between the polished article W and polishing pads 7 and 9, and relatively moving the polished article W and polishing pads 7 and 9 under predetermined bearing pressure. The polished article W is composed of glass containing silicic acid. The polishing pads 7 and 9 have a base material which is composed of a resin and is formed with a plurality of air bubbles, and polishing particles which are composed of CeO2 and are held in the air bubbles. The polishing liquid is only water.SELECTED DRAWING: Figure 1
Inventors:
Yosuke Takahashi
Makoto Sato
Takashi Goto
Makoto Sato
Takashi Goto
Application Number:
JP2019065936A
Publication Date:
December 08, 2021
Filing Date:
March 29, 2019
Export Citation:
Assignee:
Noritake Company Limited
International Classes:
B24B37/24; B24D11/00
Domestic Patent References:
| JP200425415A | ||||
| JP2009214246A | ||||
| JP201149256A |
Foreign References:
| WO2018012468A1 |
Other References:
佐藤 誠,“セラミックスナノ粒子を用いた循環型研磨加工システムの研究”,博士(工学)学位論文13903甲第523号,名古屋工業大学,2005年,p.82-99
Attorney, Agent or Firm:
Patent business corporation Patena
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