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Patent Searching and Data


Title:
GLASS CERAMIC MULTILAYERED WIRING BOARD
Document Type and Number:
Japanese Patent JP2004152834
Kind Code:
A
Abstract:

To provide a glass ceramic multilayered wiring board where a capacitor high and uniform in capacity is formed by providing a dielectric layer of barium titanate inside the insulating base body and/or on the surface of the insulating base body.

The glass ceramic multilayered wiring board 1 is composed of the insulating base body 2 formed of a glass ceramic sintered material and the dielectric layer 3 which is equipped with conductor layers 4a and 4b on its top surface and undersurface and provided inside the insulating body 2 and/or on the surface of the insulating body 2. The dielectric layer 3 is formed of a barium titanate powder which is 0.05 to 0.2 μm in average grain diameter and has a pseudo-cubic structure through a gas deposition method.


Inventors:
MAEDA TOSHIHIKO
Application Number:
JP2002313833A
Publication Date:
May 27, 2004
Filing Date:
October 29, 2002
Export Citation:
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Assignee:
KYOCERA CORP
International Classes:
H05K3/46; (IPC1-7): H05K3/46