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Title:
GLASS FIBER-COMPOSITED RESIN SUBSTRATE
Document Type and Number:
Japanese Patent JP2013129766
Kind Code:
A
Abstract:

To provide a glass fiber-composited resin substrate, which has a high-level heat resistance and transparency, and has a sufficiently low thermal expansion coefficient.

The glass fiber-composited resin substrate is composed of a curable resin composition and a glass fiber. The curable resin composition contains (A) a cage-type silsesquioxane resin having at least one group selected from the group consisting of a (meth)acryloyl group, a glycidyl group and a vinyl group, (B) an unsaturated compound having ≥2 unsaturated functional groups selected from the group consisting of groups represented by formula (1) and (2):-R1-CR2=CH2...(1) and -CR2=CH2...(2), and (C) a curing catalyst, wherein the content of (A) the cage-type silsesquioxane resin is 5 to 90 mass% with respect to the whole of the curing resin composition.


Inventors:
YUASA MASATOSHI
MURAKAMI YUKO
Application Number:
JP2011280772A
Publication Date:
July 04, 2013
Filing Date:
December 22, 2011
Export Citation:
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Assignee:
NIPPON STEEL & SUMIKIN CHEM CO
International Classes:
C08J5/04; C08F290/14; C08G77/20; C08K5/103; C08K7/14
Attorney, Agent or Firm:
Patent Business Corporation St. Crest International Patent Office