To provide a glass laminate having a high light transmitting property and an excellent electromagnetic wave-shielding performance by nipping a metal mesh formed by an etching method between two glass plates, wherein the etching method comprises peeling a resin film used as a carrier for the metal mesh in the half way of the production process to ensure high reliability and reduce the loss of the transmittance.

A metal mesh is obtained by adhering a metal foil to a resin film 5 used as a carrier for the metal mesh, patterning the metal foil, and then etching the metal foil. Therein, an adhesive between the metal foil and the resin film 5 is prepared from the same material as that for the interlayer of the glass laminate, and the carrying resin film 5 necessary for etching the metal foil 3 can be peeled after the metal mesh 3a is formed. Thereby, the metal mesh 3a can be treated in a state adhered to the resin film 5 for preventing the damage of the mesh 3a, when the metal mesh 3a is transported, but the resin film 5 unnecessary in a process for producing the glass laminate can be removed. The glass laminate which contains the metal mesh 3a therein, is thereby reliable and does not generate gas bubbles under the same production conditions as those for conventional glass laminates.