To provide a glass member with a sealing material layer allowing reduction in occurrence of cracks and splits in a glass substrate and a sealing layer due to laser radiation to the corner of the sealing material layer and reduction in airtightness by bubbling of sealing glass; and to provide an electronic device using the glass member with a sealing material layer.

The glass substrate 3 includes a sealing region 5. The sealing material layer 7, which is formed of a sealing material comprising the sealing glass, a low expansion filling material, and a laser absorbing material, is arranged on the sealing region 5 of the glass substrate 3. The frame-shaped sealing material layer 7 consists of straight line parts 7a and corner parts 7b. In the sealing material layer 7, the width L₁₂ of the corner parts 7b is wider than the width L₁₁ of the straight line parts 7a.