Title:
GLASS-SEALED THERMISTOR AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3844843
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To prevent corrosion of a copper suboxide layer made of a Dumet wire, by hermetically sealing, with a glass material, not only the copper suboxide layer on circumferential parts of a thermistor element and a lead terminal but also the copper suboxide layer portion exposed on a plane end surface on the side of a lead-out lead wire of the lead terminal.
SOLUTION: A lead terminal 2a of a Dumet wire connected with a thermistor electrode 1a of a thermistor element 1 is constituted by a Ni-Fe alloy core member 2-1a, a copper layer 2-2a, and a copper suboxide layer 2-3a. A lead terminal 2b of a Dumet wire connected with a thermistor electrode 1b of the thermistor element 1 is constituted by a Ni-Fe alloy core member 2-1b, a copper layer 2-2b, and a copper suboxide layer 2-3b. When the copper suboxide layers 2-3a and 2-3b are fused with a thermally fused glass material 3, diffusion layers 2-4a and 2-4b of copper suboxide and glass are formed, and a portion up to a plane-side exposed portion 2-3a0 of the copper suboxide layer 2-3a is sealed with the glass material 3.
Inventors:
Keiichi Kato
Application Number:
JP9327197A
Publication Date:
November 15, 2006
Filing Date:
April 11, 1997
Export Citation:
Assignee:
tdk Corporation
International Classes:
H01C7/04; (IPC1-7): H01C7/04
Domestic Patent References:
| JP3248503A | ||||
| JP7220904A | ||||
| JP57097906U | ||||
| JP63110003U |
Attorney, Agent or Firm:
Akira Yamatani
Tatsuo Imamura
Kenichi Hiraoka
Tatsuo Imamura
Kenichi Hiraoka