PURPOSE: To avoid the positional slip of a metallic lead for securing the airtightness of the whole glass sealed vessel by a method wherein metallic lead fixing glasses and an insulating cover body on the surface of an insulating substrate comprising the vessel main body while the glasses fixing the metallic lead is composed of a semicrystalline part and an amorphous part.

CONSTITUTION: The fixing lower side glasses 3 for fixing a metallic lead 4 and holding the recession 2a of an insulating base substrate 2 mounting a semiconductor element are composed of two part symmetrical semicrystalline parts 3a and amorphous parts 3b of the remaining part. Besides, the fixing upper side glasses 5 holding the frame body 6 forming a semiconductor element containing space by an insulating base substrate 2 and an insulating cover body 7 are likewise composed of two part symmetrical semicrystalline parts 5a and amorphous parts 5b of the remaining part. Through these procedures, the structure wherein the semicrystalline parts 3a, 5a come into contact with the inner lead of the metallic lead 4 while the amorphous parts 3b, 5b encircle and seal the recession 2a can satisfactorily preserve the wiring void characteristics and the solder bonding characteristics.