Title:
GLASS SUBSTRATE AND GLASS INTERPOSER
Document Type and Number:
Japanese Patent JP2022165424
Kind Code:
A
Abstract:
To provide a glass substrate capable of achieving a narrower pitch for a glass interposer while suppressing production costs, and a glass interposer using the same.SOLUTION: A glass substrate 12 has a plurality of through-holes 126. The glass substrate 12 includes a wiring filling recess part 128 provided at a location where a wiring is to be formed on a main surface of the substrate, a penetrating wiring part 122 and an in-plane wiring part 124 made of conductive material arranged in the through-holes 126 and the wiring filling recess part 128, respectively. The top surface of the in-plane wiring part 124 and the main surface of the glass substrate 12 are arranged on the same plane and have smooth surfaces, respectively.SELECTED DRAWING: Figure 1
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Inventors:
Yoteru Oyama
Shunsuke Saito
Yuzo Miyoshi
Shunsuke Saito
Yuzo Miyoshi
Application Number:
JP2022107231A
Publication Date:
October 31, 2022
Filing Date:
July 01, 2022
Export Citation:
Assignee:
Nsc corporation
International Classes:
H01L23/12; H01L23/15; H05K1/02