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Patent Searching and Data


Title:
GLASS WOVEN FABRIC BASE FOR PRINTED CIRCUIT BOARD AND LAMINATED PLATE FOR PRINTED CIRCUIT BOARD
Document Type and Number:
Japanese Patent JPH11241251
Kind Code:
A
Abstract:

To provide glass woven fabric base for a printed circuit board excellent in dimensional stability and surface flatness and a laminated plate to reinforce this glass woven fabric base.

This base has parts in which 10 mm or more of wefts and 10 mm or more of warps do not vertically intersect and, in this part where the wefts and the warps do not intersect, the wefts layer and the warp layer are set to be in a laminated state. The glass woven fabric, excluding the selvedge, preferably has parts comprising a fabric with a plain weave of 2 mm or more of width. A laminated plate for printed circuit board is obtained by using this glass woven fabric base as the reinforcing material.


Inventors:
MIYASATO KEITA
SATO EIJI
Application Number:
JP4294798A
Publication Date:
September 07, 1999
Filing Date:
February 10, 1998
Export Citation:
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Assignee:
NITTO BOSEKI CO LTD
International Classes:
C08J5/24; B32B15/08; B32B17/04; D03D1/00; D03D15/00; D03D15/12; D03D25/00; H05K1/03; (IPC1-7): D03D1/00; B32B15/08; B32B17/04; C08J5/24; D03D15/00; D03D15/12; D03D25/00