Title:
GLUE FILM
Document Type and Number:
Japanese Patent JP2017082201
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a glue film which can form an insulating layer without generating warp and crack in manufacturing of a wiring board with an implanting interconnection layer.SOLUTION: A glue film is used in a manufacturing method of a wiring board including (1) a step preparing a backing with an interconnection layer having the backing and the interconnection layer 14 provided at least one face of the backing, (2) a step forming an insulating layer by laminating glue film containing a thermosetting resin composition layer on the backing with the interconnection layer so that the interconnection layer is implanted in the thermosetting resin composition layer and by thermally curing, (3) a step of interlamellar connecting of the interconnection layer, and (4) a step removing the backing. As for the hardened material provided by thermally curing of the thermosetting resin composition layer, the mean coefficient of linear thermal expansion is not more than 16 ppm/°C, the modulus of elasticity is not more than 12 GPa, and the breaking strength is not less than 45 MPa.SELECTED DRAWING: Figure 9
Inventors:
SAKAUCHI HIROYUKI
NAKAMURA SHIGEO
MAKO GENJIN
NAKAMURA SHIGEO
MAKO GENJIN
Application Number:
JP2016187388A
Publication Date:
May 18, 2017
Filing Date:
September 26, 2016
Export Citation:
Assignee:
AJINOMOTO KK
International Classes:
C09J7/02; C09J11/04; C09J11/06; C09J109/00; C09J123/00; C09J133/08; C09J133/10; C09J163/00; C09J169/00; C09J171/02; C09J183/04; C09J201/00; H01L21/56; H01L23/12; H05K1/03
Domestic Patent References:
| JP2015017247A | 2015-01-29 | |||
| JP2014015608A | 2014-01-30 |
Attorney, Agent or Firm:
Sakai International Patent Office