Title:
接着フィルム
Document Type and Number:
Japanese Patent JP5257499
Kind Code:
B2
Abstract:
To provide a method of manufacturing semiconductor devices, the method being capable of efficiently obtaining a singulated semiconductor chip upon which an adhesive is adhered and also capable of excellently bonding a semiconductor chip to a wiring substrate, and provide an adhesive film. A layered product 60 in which a dicing tape 9, an adhesive layer 3, and a semiconductor wafer 6 are stacked in this order so that a circuit surface 6a of the semiconductor wafer 6 may face the dicing tape 9 side. A cutting position is recognized by recognizing a circuit pattern P in the circuit surface 6a from a rear surface 6b of the semiconductor wafer 6. At least the semiconductor wafer 6 and the adhesive layer 3 are cut in the thickness direction of the layered product 60. The dicing tape 9 is cured to peel off the dicing tape 9 and the adhesive layer 3. A projection electrode 4 of a semiconductor chip 26 is aligned with a wiring 12 of a wiring substrate 40. The wiring substrate 40 and the semiconductor chip 26 are bonded via an adhesive layer 23 so that the wiring 12 and the projection electrode 4 may be electrically connected to each other.
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Inventors:
Akira Nagai
Masaaki Yasuda
Keiichi Hatakeyama
Tetsuya Enomoto
Masaaki Yasuda
Keiichi Hatakeyama
Tetsuya Enomoto
Application Number:
JP2011229029A
Publication Date:
August 07, 2013
Filing Date:
October 18, 2011
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H01L21/301; C09J7/00; C09J11/04; C09J11/06; C09J201/00
Domestic Patent References:
| JP2004320057A | ||||
| JP200693285A | ||||
| JP2002252245A | ||||
| JP11330013A | ||||
| JP1280334A | ||||
| JP669323A |
Foreign References:
| WO2005004216A1 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Arai Tohio
Yoshinori Shimizu
Hiroyuki Hirano
Arai Tohio