Title:
GOLD ALLOY
Document Type and Number:
Japanese Patent JPS5976892
Kind Code:
A
Abstract:
PURPOSE:To obtain an Au-Ag-Cu alloy having a desired composition by alternately depositing Au-Ag alloy layers having a specified composition and Au-Cu alloy layers having a specified composition by plating in the same plating soln. and by diffusing the layers by heating. CONSTITUTION:A plating soln. contg. alkali cyanide compound contg. Au, Ag and Cu, little free cyanogen, and a weakly alkaline carbonic acid compound as a pH buffer deposits an alloy contg. >=95% Au+Ag at a certain current density or below, and the soln. deposits an alloy contg. >=95% Au+Cu at a certain current density or above. The compositions of the alloys depend on the concns. of Au, Ag and Cu in the plating soln., the pH of the soln., the concn. of free cyanogen in the soln. and other conditions. Au-Ag alloy layers and Au-Cu alloy layers are alternately deposited by plating in the same plating soln., and the layers are diffused by heating to form an Au-Ag-Cu alloy. The thickness of each of the layers is regulated to >=0.1mum.
Inventors:
TOGAWA EIJI
NISHIKAWA MITSUTAKA
KASAI MASAKI
TODA SHIGEO
MIYASAKA YOSHIYUKI
NISHIKAWA MITSUTAKA
KASAI MASAKI
TODA SHIGEO
MIYASAKA YOSHIYUKI
Application Number:
JP18557082A
Publication Date:
May 02, 1984
Filing Date:
October 22, 1982
Export Citation:
Assignee:
HAMASAWA KOGYO KK
SUWA SEIKOSHA KK
SUWA SEIKOSHA KK
International Classes:
C25D3/62; C25D5/50; (IPC1-7): C25D3/62; C25D5/50
Attorney, Agent or Firm:
Kisaburo Suzuki (2 outside)
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