Title:
金粉末及び該金粉末の製造方法並びに金ペースト
Document Type and Number:
Japanese Patent JP7414421
Kind Code:
B2
Abstract:
The present invention relates to a gold powder comprising gold having a purity of 99.9% by mass or more and having an average particle size of 0.01 µm or more and 1.0 µm or less. In this gold powder, a content of a chloride ion is 100 ppm or less, and a content of a cyanide ion is 10 ppm or more and 1000 ppm or less. A total of the content of a chloride ion and the content of a cyanide ion is preferably 110 ppm or more and 1000 ppm or less. The gold powder of the present invention is excellent in adaptability to various processes including bonding or the like with a content of a chloride ion, that is, an impurity, optimized. A gold paste using this gold powder is suitably used in various uses for bonding such as die bonding of a semiconductor chip, sealing a semiconductor package, and forming an electrode/wire.
Inventors:
Toshinori Kogashiwa
Masayuki Miyairi
Masayuki Miyairi
Application Number:
JP2019144018A
Publication Date:
January 16, 2024
Filing Date:
August 05, 2019
Export Citation:
Assignee:
Tanaka Kikinzoku Kogyo Co., Ltd.
International Classes:
B22F1/00; B22F1/105; B22F3/14; B22F7/08; B22F9/24; H01B1/00; H01B1/20; H01B5/00; H01B13/00
Domestic Patent References:
| JP2012087398A | ||||
| JP2018021246A | ||||
| JP2008028364A |
Foreign References:
| WO2012046641A1 |
Attorney, Agent or Firm:
Originate Patent Attorney Corporation
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