To prevent an impact force at the start of grinding and the micro vibration of a grinding stone during grinding from being transmitted to a wafer when grinding the wafer by bringing the grinding stone into contact with the wafer.
This grinder comprises at least: a grinding means 19 having a chuck table for holding the wafer, the grinding stone 230 constituted in such a manner that a grinding stone part 230b for grinding the wafer which is held to the chuck table is fixed to a wheel base 230a, and a wheel mount 210 for supporting the wheel base 230a; and a grinding feeding means which makes the grinding means 19 approach the chuck table and separate therefrom. Damping rubber 220 whose repulsion resilience specified in JIS K6255 is 2% to 4% is interposed between the wheel base 230a and the wheel mount 210, and thus the impact force at the start of the grinding and the micro vibration of the grinding stone 230 during grinding are absorbed.
| JP2005335014A | 2005-12-08 | |||
| JPH0727754U | 1995-05-23 |
Kyoko Kawamura
Ken Kubo