To provide a grinder pad and its method capable of grinding a wafer without damaging the notch of the wafer stably for a long time without generating its own fragments when grinding the notch of the wafer.
This grinder pad 10 is constituted of a disc-shaped pad 11 made of synthetic resin such as foamed resin and a holding plate 12 fixed to the both faces of the pad 11 so that the peripheral edge of the pad 11 can be exposed. The cross-section of the peripheral edge of the pad 11 is shaped so as to fit into a notch 21. The pad 11 is formed of a foam such as foamed urethane, and the mean form diameter of the foam ranges from 10μm to 500μm, and the hardness ranges 25° to 95° in a Shore hardness A scale. While the grinding pad 10 is rotating, the peripheral edge of the pad 11 is fitted and butted to the notch 21, and slurry is supplied through a nozzle 14 to the contact part of the peripheral edge of the pad 11 with the notch 21 so that the notch 21 can be ground.
SATO SATORU
OSAWA KAZUNARI
Akira Hori