GRINDER FOR WAFER-LIKE MATERIAL

Title:

GRINDER FOR WAFER-LIKE MATERIAL

Document Type and Number:

Japanese Patent JPS5287790

Kind Code:

A

Abstract:

PURPOSE: To obtain pieces with fewer surface flaws by lifting up a plate within the range of its dynamical friction resistance during the rotation of a grinder.

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Inventors:

TSUKAHARA MASARU
NAKAMOTO KAZUHISA
HORIKOU HITOSHI

Application Number:

JP411576A

Publication Date:

July 22, 1977

Filing Date:

January 19, 1976

Export Citation:

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Assignee:

HITACHI LTD

International Classes:

B24B37/04; B24B37/10; B24B37/30; (IPC1-7): B24B37/04; B24B41/06

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