Title:
GRINDER
Document Type and Number:
Japanese Patent JP2018086692
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a grinder which is capable of cleaning a suction surface of a carrier pad better and can be downsized.SOLUTION: A grinder has cleaning means including: a first cleaning part (85) cleaning a suction surface (38b) of a carrier pad (38); a second cleaning part (86) cleaning a protective tape (T) to be a held surface held by a chuck table (42) of a wafer (W) held by the carrier pad; and switching means (88) performing switching between a cleaning position higher than an upper surface of the other cleaning part and a retreat position lower than the upper surface of the other cleaning part. The first cleaning part includes: a grinding member (851) grinding attachments attached to the suction surface; and a brush (852) for removing the attachments from the suction surface. The second cleaning part configures a member in contact with the protective tape of the wafer with a sponge (862), performs switching of the first cleaning part and the second cleaning part according to operation of the switching means, and cleans the suction surface of the carrier pad and the protective tape of the wafer.SELECTED DRAWING: Figure 2
Inventors:
KAKEI YOSUKE
RIKIISHI TOSHIYASU
RIKIISHI TOSHIYASU
Application Number:
JP2016229999A
Publication Date:
June 07, 2018
Filing Date:
November 28, 2016
Export Citation:
Assignee:
DISCO ABRASIVE SYSTEMS LTD
International Classes:
B24B55/06; B08B1/00; B08B3/02; B08B5/00; B23Q11/00; B24B7/22; H01L21/304
Domestic Patent References:
| JP2010094785A | 2010-04-30 | |||
| JP2003045841A | 2003-02-14 | |||
| JP2001198824A | 2001-07-24 | |||
| JP2007276093A | 2007-10-25 |
Attorney, Agent or Firm:
Hiroyoshi Aoki
Amada Masayuki
Amada Masayuki
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