Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
研削盤
Document Type and Number:
Japanese Patent JP5416527
Kind Code:
B2
Inventors:
Noboru Watanabe
Hiroaki Unoki
Application Number:
JP2009225270A
Publication Date:
February 12, 2014
Filing Date:
September 29, 2009
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Taiyo Koki Co., Ltd.
International Classes:
B24B5/00
Domestic Patent References:
JP7040200A
JP11347896A
JP4109848U
JP7096438A
JP6031602A
JP7266173A
JP63166334U
JP4948187U
Foreign References:
US5213348
Attorney, Agent or Firm:
Tsutomu Shimoichi



 
Previous Patent: SEALING METHOD

Next Patent: SEALING METHOD